Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading

authored by: Bilen Emek Abali, Fadi Aldakheel, Tarek I. Zohdi
Abstract: Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.
Organisation(s): Institute of Continuum Mechanics
External Organisation(s): Uppsala University
University of California at Berkeley
Type: Contribution to book/anthology
Pages: 1-14
No. of pages: 14
Publication date: 13.03.2022
Publication status: E-pub ahead of print
Peer reviewed: Yes
ASJC Scopus subject areas: General Engineering, General Computer Science
Electronic version(s): https://doi.org/10.1007/978-3-030-87312-7_1 (Access: Closed)
: Details in the research portal "Research@Leibniz University"